SK Hynix Readies 8 GB RAM Chips For 2017 Mobile Devices

SK Hynix has quietly unveiled its new 8 GB LPDDR4 mobile DRAM package that is aimed ath future smartphones and tablets. The chips will be made using the older 21nm manufacturing process, but will offer better price/performance ratio compared to the more efficient 10nm process Samsung is using for its 8 GB module.

There is no mention of power consumption, but the 8 GB module from SK Hynix will be running at 3.73GHz, with each chip rocking 4 x 2GB modules, offering bandwidth of up to 29.8Gbps. Due to lower price, the new module is most likely to be used in more affordable devices.