Taiwanese chipmaker MediaTek announced a new Helio system-on-chip (SoC) targeted at ultra-thin smartphones with dual cameras. The new Helio P25 is made using the 16nm FinFET process and is 25% more power efficient than the Helio P10. It also has MediaTek Imagiq Image Signal Processor (ISP) technology with up to 13 MP dual cameras support.
The octa-core ARM Cortex-A53 CPU is clocked at 2.5 GHz with ARM Mali-T880 dual GPU is clocked at 900 MHz. There is also support for up to 6 GB of RAM, LTE connectivity, and a single 24 MP camera on back. First smartphones and tablets with the chipset are expected to be on the market in Q1 2017.