With only days away from the biggest mobile event, new details about Sony Xperia SP have emerged. The handset was rumored in the past, but now we have additional details about the handset's design and specifications. The Xperia SP was rumoured to have a 4.3-inch screen, but rather it features a 4.6-inch with a high-definition 720p resolution. The device is powered by a Qualcomm Snapdragon S4 Pro MSM8960T SoC, along with a 1.7 GHz dual-core processor and Adreno 320 GPU.
About the handset design, it will have an aluminum frame and a removable plastic back cover. Underneath the cover, we can find the SIM and microSD slots. We also know that the phone will feature 8 GB of internal storage, an 8-megapixel Sony Exmor RS sensor and one of its three region-specific versions will come with LTE radio. Measuring 130.6 x 67.1 x 9.98 mm, the Xperia SP weighs 155 g.
Though, there is still no word about the announcement as Sony will not have an official press event at Mobile World Congress 2013.
|Topics||Sony, MWC, 4G LTE, 4.3-inch, Xperia SP, 4.6-inch|